Chapter 1 Introduction
1.1 Executive Summary
1.2 Market Definition
1.3 Scope of the Study
Chapter 2 Research Methodology
2.1 Secondary Research
2.2 Primary Research
2.3 Analytic Tools and Model
2.4 Economic Indicator
2.4.1 Base Year, Base Currency, Forecasting Period
2.5 Expert Validation
2.6 Study Timeline
Chapter 3 Market Analysis
3.1 Industry Value Chain Analysis
3.2 Porter's Five Analysis
3.2.1 Bargaining Power of Buyers
3.2.2 Bargaining Power of Suppliers
3.2.3 Threats of Substitutes
3.2.4 Threats of New Entrants
3.2.5 Industry Rivalry
3.3 PESTLE Analysis
3.3.1 Political
3.3.2 Economical
3.3.3 Social
3.3.4 Technological
3.3.5 Legal
3.3.6 Environmental
3.4 SWOT Analysis
3.4.1 Strengths
3.4.2 Weakness
3.4.3 Opportunities
3.4.4 Threats
3.5 Y-O-Y Analyses
Chapter 4 Market Dynamics
4.1 Drivers
4.2 Restraints
4.3 Opportunities
4.4 Challenges
Chapter 5 Market Segmentation Analysis
Chapter 6 Market Segmentation by Application
6.1 ICT
6.2 Industrial
6.3 Automobile
6.4 Consumer Electronics
6.5 Medical
6.6 Computers and Peripherals
6.7 Aerospace & Defense
6.8 Others
Chapter 7 Market Segmentation by Design Architecture
7.1 By Customization
7.1.1 Customizable IP Care
7.1.2 Standard IP Core
7.2 By Design Process
7.2.1 Embedded Processor IP
7.2.1.1 Single Core Processor IP
7.2.1.2 Multi-Core Processor IP
7.2.2 General processor IP
Chapter 8 Market Segmentation by Form factor
8.1 System on chip(SoC) IP
8.1.1 Analog and Mixed-Signal SoC IP
8.1.2 Programmable SoC IP
8.1.3 General Purpose SoC IP
8.1.4 Digital SoC IP
8.1.5 Memory SoC IP
8.1.6 Application Specific SoC IP
8.1.7 Others
8.2 Integrated Circuit IP
8.2.1 Analog and Mixed Signal Integrated Circuit IP
8.2.2 Programmable Integrated Circuit IP
8.2.3 General Purpose Integrated Circuit IP
8.2.4 Digital Integrated Circuit IP
8.2.5 Memory Integrated Circuit IP
8.2.6 Application Specific Integrated Circuit (ASIC) IP
8.2.7 Others
Chapter 9 Market Segmentation by Geography
9.1 Europe
9.1.1 Introduction
9.1.2 Spain
9.1.3 UK
9.1.4 Russia
9.1.5 France
9.1.6 Italy
9.1.7 Others
Chapter 10 Competitive Landscape
10.1 Mergers & Acquisitions, Joint Ventures, Collaborations, and Agreements
10.2 Strategies Adopted By Top Companies
10.3 Market Share Analysis
Chapter 11 Company Profile
11.1 EASii IC
11.1.1 Introduction
11.1.2 Company overview
11.1.3 Financial Performance
11.1.4 Product Benchmarking
11.2 Dolphin Integration
11.3 Synergie CAD
11.4 BARCO Silex
11.5 Rockwood Wafer Reclaim
11.6 KM211
11.7 System Plus Consulting
11.8 X-FAB
11.9 Equipic Supply Chain
11.10 Raycics
Chapter 12 Market Estimates and Forecast
12.1 Market Estimation and Forecast 2018-2024(USD Billion)
12.1.1 Market Estimates and Forecast by Application 2018-2024 (USD Billion)
12.1.2 Market Estimates and Forecast by Design Architecture 2018-2024 (USD Billion)
12.1.3 Market Estimates and Forecast by Form Factor 2018-2024 (USD Billion)
12.1.4 Market Estimates and Forecast by Geography 2018-2024 (USD Billion)
Chapter 13 Market Insights
13.1 Insights of Industry Experts
13.2 Investment Opportunities
13.3 Analyst Opinion
Chapter 14 Appendix
14.1 List of Tables
14.2 List of Figures
