Published April 13, 2018
Adhesives is a substance that compels one surface or both surfaces in which two separate items that bind them together and curbs their separation. Manufacture and assembly of electronic circuits and products are the primary use of electronic adhesives. Bonding the wire tacking, surface-mount components, and encapsulating elements are the various applications of the adhesives. They help in the miniaturization of electronics components, and they are the longstanding trend of reducing the size of electronics.
Global Electronics Adhesives Market Segments Size:
Global Electronics Adhesives Market size is projected to reach approximately $9.67 billion by the end of 2024 with a CAGR of close to 10% from $4.78 billion in 2017 during the forecast timeline 2018-2024.
Global Electronics Adhesives Market Segments Growth:
Key parameters promoting the market growth include increased market penetration in developing countries, rising technological dominance, increasing demand from the automotive industry, growing demand for compact electronic and communication devices, rapid growth in application industries in emerging markets. However, the high cost of installation for laminating and packaging the machinery is thereby hampering the growth of the market. Various opportunities for electronics adhesives market include expansion and acquisitions of the local players, growing demand, and penetration of electric vehicles, increasing demand from the automotive industry.
Global Electronics Adhesives Market Segments Share:
By form, liquid form, paste form, and solid form are the sub-segments. Among them, liquid form segment is expected to hold the most significant share in the market because of its strong adhesion strength. The electronics industry makes use of liquid adhesives for mounting the semiconductor dyes, as conformal coatings on printed circuits boards (PCBs) and potting. These adhesive forms are available in various compositions such as epoxies, silicones, and acrylics. Increasing demand for PCBs from telecommunication, consumer, and microelectronic assembly application industries has led to growing need for liquid form adhesives in the market.
By product type, electrically conductive adhesives, thermally conductive adhesives, UV curing adhesives, and others are the sub-segments. Electrically conductive adhesives segment is anticipated to account for the most significant share in the market during the forecast period owing to high electrical conductivity, and ability to allow the passage of current while initiating an electrical connection between two bonded surfaces, electronic adhesives are widely used in microelectronic industry for packaging applications. The factors that are boosting the growth of the segment include increasing technological advancement, growing demand from the flip-flop applications, and emerging microelectronic packaging industries. UV-curing adhesives segment is projected to witness the highest growth rate during the forecast period, owing to solvent-free and environment-friendly characteristics
By material type, acrylics, epoxies, polyurethanes, silicone, and others are the sub-segments. Silicone adhesives segment is expected to hold the most significant share in the market because of the rising demand from the electronics industry. By applications, Surface mounting, conformal coatings, wire tacking, potting and encapsulation, and others are the sub-segments. By Geography, Asia-Pacific is projected to hold the most significant share in the market during the forecast period owing to the high economic growth rate, increasing manufacturing industries, cheap labor, and improving electronic adhesives-based application patents. Involvement of government organizations for the commercialization and enhancement of electronic adhesives are the factors that are propelling the growth of electronic adhesives in this region. China is the most significant market for electronic adhesives in the Asia-Pacific region owing to rise in connectivity, growing levels of urbanization, increasing expansion, and advanced technology.
Global Electronics Adhesives Market Trends:
Global Electronics Adhesives Market Research Report:
An executive summary condensing the whole report such that essential authority can rapidly twist up doubtlessly acquainted with brief overview and conclusion.
To have complete market analysis, industry value chain analysis, Porter’s Five Force Analysis, PESTLE, SWOT analysis, and Y-o-Y analysis were carried to understand the market more comprehensively.
Regional and global diversity is analyzed with the major countries and the unions. Scrutinizing the revenue generation on Year-On-Year
Identifying DROC in the current market and their impact in altering the market dynamics.
Competitive landscape analysis to identify the mergers and acquisitions which will have a comparative financial analysis with major competitors.
Expertise investment opportunities by an analyst to the individual and organization to have a better foothold in the market.
The major market players, such as
Along with these companies, there were many other companies considered/cited in the report while analyzing the global electronics adhesives market. These companies hold substantial share-owning to the nature of the industry whereas rest of the market shares are marginal chunks to regional and local level manufacturers. Other players have considerable presence owing to its robust brand image, geographical reach and strong customer base.
Chapter 1 Introduction
1.1 Executive Summary
1.2 Market Definition
1.3 Scope of the Study
Chapter 2 Research Methodology
2.1 Secondary Research
2.2 Primary Research
2.3 Analytic Tools and Model
2.4 Economic Indicator
2.4.1 Base Year, Base Currency, Forecasting Period
2.5 Expert Validation
2.6 Study Timeline
Chapter 3 Market Analysis
3.1 Industry Value Chain Analysis
3.2Porter’s Five Force Analysis
3.2.1 Bargaining Power of Buyers
3.2.2 Bargaining Power of Suppliers
3.2.3 Threats of Substitutes
3.2.4 Threats of New Entrants
3.2.5 Industry Rivalry
3.3 PESTLE Analysis
3.4 SWOT Analysis
3.5 Y-O-Y Analyses
Chapter 4 Market Dynamics
4.1.1 Increased market penetration in developing countries
4.1.2 Rising technological dominance
4.1.3 Increasing demand from the automotive industry
4.1.4 Increasing demand for compact electronic and communication devices
4.1.5 Rapid growth in application industries in emerging markets
4.2.1 High cost of installation for laminating and packaging the machinery
4.3.1 Expansion and acquisitions of the local players
4.3.2 Growing demand and penetration of electric vehicles
4.3.3 Increasing demand from the automotive industry
4.4.1 Volatility in raw material prices
Chapter 5 Global Electronics Adhesives Market– By Form
5.1 Liquid form
5.2 Paste form
5.3 Solid form
Chapter 6 Global Electronics Adhesives Market– By Product Type
6.1 Electrically conductive adhesives
6.2 Thermally conductive adhesives
6.3 UV curing adhesives
Chapter 7 Global Electronics Adhesives Market– By Material Type
Chapter 8 Global Electronics Adhesives Market– By Applications
8.1 Surface mounting
8.2 Conformal coatings
8.3 Wire tacking
8.4 Potting and encapsulation
Chapter 9 Global Electronics Adhesives Market- By Geography
9.2 North America
9.3.6. Rest of Europe
9.4.4 South Korea
9.4.5 Australia & New Zealand
9.4.6 Rest of APAC
9.5 South America
9.6 Middle East & Africa
9.6.1 Middle East
Chapter 10 Global Electronics Adhesives Market- Company Profiles
10.1 BASF SE
10.2 The Dow Chemical Co.
10.3 H.B. Fuller company
10.4 Henkel AG & Co. KGAA
10.5 LG Chemical Limited
10.6 Mitsui Chemicals, Inc.
10.7 3M Company
10.8 Arkema Group (Bostik SA)
10.9 Ashland Inc.
10.10 Avery Dennison Corp.
10.11 Huntsman Corp.
10.13 LORD Corp.
10.14 Tesa SE (A Beiersdorf Company)
10.15 Wacker Chemie AG
Chapter 11 Global Electronics Adhesives Market- Competitive Landscape
11.1. Market Share Analysis
11.2. Strategies Adopted by top companies
11.3. Mergers, Acquisitions, Collaborations & Agreements
Chapter 12 Market Insights
12.1. Industry Experts Insights
12.2. Analysts Opinions
12.3. Investment Opportunities
Chapter 13 Appendix
13.1 List of Tables
13.2 List of Figures